- Preparation method of high-heat-resistance diepoxide
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The invention discloses a preparation method of a high-heat-resistance diepoxide. The preparation method comprises the following steps: in the presence of 4-toluenesulfonyl chloride and pyridine, reacting 4, 4'- dihydroxydicyclohexane with a metal halide; then carrying out dehalogenation in an alkaline environment to prepare [1, 1' -bis(cyclohexane)]-3, 3' -diene; or in the presence of thiourea, 4, 4apos;-dihydroxy dicyclohexane is subjected to a reaction with halogenated succinimide; then carrying out dehalogenation in an alkaline environment to prepare [1, 1'-bis(cyclohexane)]-3, 3'-diene; and then reacting the[1, 1'-bis(cyclohexane)]-3, 3'-diene with peroxyacetic acid to produce the diepoxide. An existing method has the technical defects of high energy consumption, poor selectivity and the like, isomers exist when a hydroxyl group is dehydrated in a strongly acidic environment, rectification purification is needed, and the product yield is low, and based on the problems, technical innovation is carried out, the hydroxyl group is halogenated firstly, then double bonds are formed in a strongly alkaline environment, post-treatment steps are simplified, and especially, the existence of an isomer is avoided, and the (3, 4, 3 ', 4'-diepoxy)bicyclohexane can be efficiently and conveniently prepared.
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- Safe, environment-friendly and controllable synthetic process of di-epoxide
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The invention relates to the field of synthesis of epoxide, and more specifically, relates to a safe, environment-friendly and controllable synthetic process of di-epoxide. The synthetic process of the di-epoxide at least comprises the following steps: mixing diolefin, carboxylic acids, basic salt and solvent, and cooling; dropwise adding a hydrogen peroxide solution for 1-12 h; standing for layering to obtain a lower layer organic phase-1, washing the organic phase-1 with a cleaning solution, and standing for layering to obtain a lower layer organic phase-2; purifying. The reaction system ofthe synthetic process is simple, environmentally friendly, safe and controllable, is low in production cost, and can meet the requirements of technical economy; the prepared di-epoxide is high in purity and yield and low in solvent content, chroma and halogen content, and is suitable for large-scale industrial production.
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Paragraph 0203-0219
(2019/10/01)
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- Bicyclic oxide preparation method (by machine translation)
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The present invention provides bicyclic oxide preparation method, the invention bicyclic oxide catalysting preparation method comprises, hydrogen peroxide and a buffer in the presence of a diene compound epoxidation to prepare bicyclic oxide step. (by machine translation)
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- PHOTOCURABLE COMPOSITION, CURED PRODUCT AND OPTICAL COMPONENT USING SAME
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Provided is a photocurable composition which less causes resin-induced swelling of molds, allows the molds to endure more satisfactorily, and has excellent economic efficiency. This photocurable composition includes components (A), (B), (C), and (D). The component (A) is present in a content of 10 to 50 weight percent of the totality of photocurable compounds contained in the photocurable composition. The component (A) is a cycloaliphatic epoxy compound represented by Formula (a). The component (B) is an oxetane compound having a solubility parameter of 9.5 (cal/cm3)1/2 or more as determined by the Fedors' method. The component (C) is a glycidyl ether epoxy compound having a molecular weight of 250 or more. The component (D) is a photoinitiator: wherein R1 to R18 are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group.
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Paragraph 0142-0144
(2018/05/26)
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- ALICYCLIC DIEPOXY COMPOUND, EPOXY RESIN COMPOSITION, AND CURED PRODUCT
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Disclosed is an alicyclic diepoxy compound which gives a cured article suffering from no deterioration in properties even when used in hot and humid surroundings or used under such conditions as to give a strong acid, which is highly reactive upon curing, and which gives a cured article superior typically in thermal stability. Specifically, the alicyclic diepoxy compound includes a 3,4,3',4'-diepoxybicyclohexyl compound represented by following Formula (1): wherein R1 to R18 each represent a hydrogen atom, a halogen atom, a hydrocarbon group which may have an oxygen atom or a halogen atom, or a substituted or unsubstituted alkoxy group, in which the alicyclic diepoxy compound contains isomers of the 3,4,3',4'-diepoxybicyclohexyl compound in a content of less than 20% based on the total of the 3,4,3',4'-diepoxybicyclohexyl compound and the isomers thereof in terms of peak area ratio as determined by gas chromatography.
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Page/Page column 15-18
(2009/04/23)
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- PROCESS FOR PREPARATION OF ALICYCLIC DIEPOXY COMPOUNDS, CURABLE EPOXY RESIN COMPOSITIONS, EPOXY RESIN COMPOSITIONS FOR THE ENCAPSULATION OF ELECTRONIC COMPONENTS, STABILIZERS FOR ELECTRICAL INSULATING OILS, AND CASTING EPOXY RESIN COMPOSITIONS FOR ELECTRICAL INSULATION
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According to the present invention (1), an alicyclic diepoxy compound represented by the following general formula (I): can be produced in high purity and high yields at low cost, by epoxidizing the corresponding alicyclic diolefin compound with an organic percarboxylic acid. As the alicyclic diepoxy compound lacks an ester group in the molecule, it will show high reactivity for a cationic catalyst. Besides, when it is used as a curable epoxy resin composition of the present invention (2), it will show an effect of lowering its curing temperature or reducing its curing time. The curable epoxy resin composition has high reactivity for various curing agents, low viscosity, and excellent workability. Moreover, the curable resin composition is also superior in that it has less effect to working surroundings, and a cured product thereof shows useful physical properties for the uses in coatings, ink, adhesives, sealants, encapsulants, and the like. Furthermore, as a resin composition of the present invention (3) shows a low coefficient of water absorption, it is of extremely high quality as an epoxy resin composition for the encapsulation of electronic parts. In addition, a stabilizer for an electrical insulating oil of the present invention (4) (i.e., the alicyclic diepoxy compound or an electrical insulating oil containing such a compound) is low in acid value, and the stabilizer improves the properties of the insulating oil. In addition, a cured product obtained by curing a casting epoxy resin composition for electrical insulation of the present invention (5) has excellent properties such as high bending strength, high Tg, and low permittivity.
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Page/Page column 18
(2008/06/13)
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