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Paper
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behavior with voltage and current is proportional to V . This
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2
corresponds to the trap free space charge limited current
8 A. Biswas, S. Mukhopadhyay, R. S. Singh, A. Kumar,
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3
7
(SCLC) region.
3, 5417–5425.
9
N. Malviya, C. Sonkar, R. Ganguly, D. Bhattacherjee,
K. P. Bhabak and S. Mukhopadhyay, ACS Appl. Mater.
Interfaces, 2019, 11, 47606–47618.
4
. Conclusions
Herein, we have developed the practical synthesis of a new
modular and functional metallogel, based on a succinic acid
derivative and Cu(OAc) in DMF. The gel-phase material was
1
1
1
1
1
1
1
1
0 V. Van Tran, D. Park and Y. C. Lee, Environ. Sci. Pollut. Res.,
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2
1 Q. Lin, T. T. Lu, X. Zhu, B. Sun, Q. P. Yang, T. B. Wei and
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confirmed based on rheological experiments and also
established was the mechanical stability of the metallogel.
Well-defined cross-linked nanofibers of the supramolecular
Cu -based metallogel were confirmed via SEM, TEM, and
AFM analyses. FT-IR, UV-visible, ESI-MS and Job plot results
established the mechanism of the metallogel. The optical
band-gap measurements of the metallogel based on the succinic
acid-derived compound (H L) and Cu(OAc) suggest the semi-
conducting nature of the metallogel. Additionally, we fabricated
an MS junction thin-film electronic device from Ag metal and the
4
semiconducting Cu–H L gel. The nonlinear charge transportation
of the device obtained from the I–V characteristic graph confirmed
the fabrication of a Schottky diode. Thus, the present study of
2
+
4 S. Ganta and D. K. Chand, Inorg. Chem., 2018, 57,
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4
2
5 S. Dhibar, A. Dey, A. Dey, S. Majumdar, D. Ghosh, P. P. Ray
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4
ITO/Cu–H L/Ag suggests the future possibility of achieving
supramolecular Cu metallogel based electronic devices for
advanced technology.
2
+
18 R. Borthakur, A. Kumar, A. Lemtur and R. A. Lal, RSC Adv.,
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2
1
9 R. K. Upadhyay, A. P. Singh, D. Upadhyay, S. Ratan,
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Conflicts of interest
20 R. K. Upadhyay, A. P. Singh, D. Upadhyay, A. Kumar,
C. Kumar and S. Jit, IEEE Electron Device Lett., 2019, 40,
There are no conflicts to declare.
1961–1964.
Acknowledgements
21 M. Sutradhar, T. Roy Barman, J. Kxlanke, M. G. B. Drew and
E. Rentschler, Polyhedron, 2013, 53, 48–55.
The present work is financially supported by the IIT (BHU),
Varanasi and MHRD, New Delhi, India. The authors are grateful
to the CIFC, IIT (BHU) and Department of Chemistry, IIT (BHU)
for providing the instrumentation facilities. The authors are
also grateful to Mayank Varshney, Manoj Sharma, and Anton
Paar for providing the rheological facilities.
2
2
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5 X. Wang, T. He, L. Yang, H. Wu, R. Zhang, Z. Zhang,
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