RSC Advances
Paper
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.8–2.5 (m, 1.2H), 2.1–0.7 (m, 22H); FTIR 2998, 2944, 2091, 1735, 16 W. Y. Chou and H. L. Cheng, Adv. Funct. Mater., 2004, 14,
ꢂ1
456, 1247, 1139, 999, 642 cm
.
811.
17 A. Facchetti, M. H. Yoon and T. J. Marks, Adv. Mater., 2005,
1
7, 1705.
Conclusions
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8 C. Kim, A. Facchetti and T. J. Marks, Science, 2007, 318, 76.
In summary, we have demonstrated that polystyrene and poly(- 19 C. Huang, J. E. West and H. E. Katz, Adv. Funct. Mater., 2007,
methyl methacrylate) can be effectively thermally cross-linked at
17, 142.
relatively low temperature. This new cross-linking method is 20 L. G. Kaake, Y. Zou, M. J. Panzer, C. D. Frisbie and X.-Y. Zhu,
compatible with plastic substrates for exible electronic appli-
J. Am. Chem. Soc., 2007, 129, 7824.
cations. The cross-linked thin-lms show good solvent resistant 21 H. Klauk, M. Halik, U. Zschieschang, G. Schmid, W. Radlik
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and W. Weber, J. Appl. Phys., 2002, 92, 5259.
signicantly reduced leakage current density compared with 22 S. Y. Yang, S. H. Kim, K. Shin, H. Jeon and C. E. Parka, J. Appl.
uncross-linked thin-lms in MIM testing devices. The current
Phys., 2006, 88, 173507.
cross-linking method will have wide applications in fabrication 23 S. C. Lim, S. H. Kim, J. B. Koo, J. H. Lee, C. H. Ku, Y. S. Yang
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4 C. Kim, Z. Wang, H. J. Choi, Y. G. Ha, A. Facchetti and
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Acknowledgements
This work was supported by National Natural Science Founda-
tion of China (NSFC Grant no. 21174084 and 21274087), and
was supported by the Doctoral Fund of Ministry of Education of
China (Grant no. 20120073110032).
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28984 | RSC Adv., 2015, 5, 28980–28984
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