Tetramethoxysilane

Base Information

• Chemical Name: Tetramethoxysilane
• CAS No.: 681-84-5
• Deprecated CAS: 12547-31-8
• Molecular Formula: C4H12O4Si
• Molecular Weight: 152.222
• Hs Code.: 29209085
• European Community (EC) Number: 211-656-4
• ICSC Number: 1188
• NSC Number: 67383
• UN Number: 2606
• UNII: 19D35VPL66
• DSSTox Substance ID: DTXSID3027291
• Nikkaji Number: J36.490H
• Wikipedia: Tetramethyl_orthosilicate
• Wikidata: Q377159
• ChEMBL ID: CHEMBL3183859
• Mol file: 681-84-5.mol

Synonyms:silicic acid tetramethyl ester;tetramethoxysilane

Chemical Property of Tetramethoxysilane

Chemical Property:

• Appearance/Colour: Colorless transparent liquid
• Vapor Pressure: 3.35 psi ( 20 °C)
• Melting Point: -4 °C(lit.)
• Refractive Index: n20/D 1.368(lit.)
• Boiling Point: 121.207 °C at 760 mmHg
• Flash Point: 28.889 °C
• PSA: 36.92000
• Density: 0.977 g/cm³
• LogP: 0.00760
• Storage Temp.: Flammables area
• Sensitive.: Moisture Sensitive
• Water Solubility.: hydrolysis
• Hydrogen Bond Donor Count: 0
• Hydrogen Bond Acceptor Count: 4
• Rotatable Bond Count: 4
• Exact Mass: 152.05048539
• Heavy Atom Count: 9
• Complexity: 55.5
• Transport DOT Label: Poison Inhalation Hazard Flammable Liquid

Purity/Quality:

99% ^*data from raw suppliers

Tetramethyl orthosilicate ^*data from reagent suppliers

Safty Information:

• Pictogram(s): T+
• Hazard Codes: T+
• Statements: 10-26-37/38-41
• Safety Statements: 16-26-36/37/39-45-28A

MSDS Files:

SDS file from LookChem

Total 1 MSDS from other Authors

Useful:

• Chemical Classes: Metals -> Metalloid Compounds (Silicon)
• Canonical SMILES: CO[Si](OC)(OC)OC
• Inhalation Risk: A harmful contamination of the air can be reached very quickly on evaporation of this substance at 20 °C.
• Effects of Short Term Exposure: The substance is severely irritating to the eyes, skin and respiratory tract. Inhalation of the vapour may cause lung oedema. The effects may be delayed. Medical observation is indicated.
• Effects of Long Term Exposure: The substance may have effects on the kidneys and liver.
• Description: Tetramethyl orthosilicate is the chemical compound with the formula Si(OCH3)4. This molecule consists of four methoxy groups bonded to a silicon atom.Two common organic precursors are tetraethyl orthosilicate (TEOS) and tetramethyl orthosilicate (TMOS). The latter is more toxic than the former.Tetraethyl orthosilicate (TEOS), Si(OC2H5)4, is the first alkoxide of the series, followed by tetramethyl orthosilicate (TMOS), Si(OCH3)4, which is, however, less safe to handle and hydrolyzes faster than TEOS.The hydrolysis of TMOS is, in fact, around six times faster: in general, a lower hydrolysis rate is associated with an increase of the organic group size in the silicon alkoxide. The properties of the silicon alkoxides change according to the dimension of the alkoxy; larger groups produce an increase in molecular weight, viscosity, and boiling point and a decrease in density of the alkoxides.As a rule of thumb, a larger size of the alkoxy group is associated with a lower hydrolysis rate due to the steric hindrance. The reactivity follows the sequence, with tetramethyl orthosilicate the most reactive alkoxide:tetramethyl orthosilicate >tetraethyl orthosilicate>tetra-n-propylorthosilicate>tetrabutyl orthosilicate
• Uses: Tetramethyl orthosilicate (TMOS) is popularly used in the sol-gel synthesis of silicates1 and chromium-doped silicates and in the formation of hexagonal mesoporous silica layers. Coating screens of television picture tubes; mold binders; corrosion-resistant coatings; catalyst preparation; silicone intermediate Tetramethyl Orthosilicate is a compound used in the research of the multifunctionality of silicified nanoshells and the efficiency at adsorbing cadmium ions at cell interfaces.

Technology Process of Tetramethoxysilane

There total 97 articles about Tetramethoxysilane which guide to synthetic route it. The literature collected by LookChem mainly comes from the sharing of users and the free literature resources found by Internet computing technology. We keep the original model of the professional version of literature to make it easier and faster for users to retrieve and use. At the same time, we analyze and calculate the most feasible synthesis route with the highest yield for your reference as below:

synthetic route:

Reference yield: 70.0%

methanol (67-56-1) → tetramethylorthosilicate (681-84-5) + hexamethoxydisiloxane (4371-91-9)

Guidance literature:

With copper(l) chloride; silicon; at 250 ℃; for 3h; under 159611 Torr; Temperature; Pressure; Autoclave;

DOI:10.1007/s11172-017-1726-7

Reference yield:

methanol (67-56-1) + benzaldehyde dimethyl acetal (1125-88-8) → tetramethylorthosilicate (681-84-5) + benzaldehyde (100-52-7)

Guidance literature:

With carbon dioxide; silica gel; potassium hydroxide; at 240 ℃; for 24h; under 15001.5 Torr; Autoclave;

DOI:10.1246/bcsj.20200054

Reference yield:

methanol (67-56-1) + tetraisocyanatosilane (3410-77-3) → tetramethylorthosilicate (681-84-5) + silicon dimethoxy diisocyanate (18147-89-2) + silicon trimethoxy isocyanate (18169-84-1) + silicon methoxy triisocyanate (5578-37-0)

Guidance literature:

at 25 ℃;

upstream raw materials:

methanol

tetraisocyanatosilane

methyl nitrite

phosphoric acid dimethyl ester-trimethoxysilanyl ester

Downstream raw materials:

hexamethoxydisiloxane

tetrapropoxysilane

butyltrimethoxy silane

Di-(n-butyl)-dimethoxysilan

Refernces

• 1、 Wannagat et al.. "". . p. 1407. Retrieved 1967.
• 2、 Huang, Zhong,Li, Yuye,Tian, Qiang,Zhang, Zongfan,Li, Xia,Liang, Xuesong,Du, Lusha. "New direct transformation reaction of SiF4 with methanol and aluminum with the aid of iodine to prepare tetramethoxysilane and aluminum fluoride". . p. 6 - 10. Retrieved 2014.
• 3、 Lazareva,Lazarev. "Si–C bond cleavage in N-[(trimethoxysilyl)methyl)]amine by methanol". . p. 2555 - 2557. Retrieved 2016.
• 4、 Pypowski, Krzysztof,Mojzych, Mariusz. "Reactivity of heterocyclic α-aminomethylsilanes with alcohols". . p. 320 - 324. Retrieved 2021/03/31.
• 5、 -. "Method for preparing organosilane by utilizing organosilicone byproduct". Paragraph 0024. . Retrieved 2020/07/13.