CID 6454485

Base Information

• Chemical Name: CID 6454485
• CAS No.: 62929-02-6
• Molecular Formula: C35H28N2O7
• Molecular Weight: 588.60602
• European Community (EC) Number: 676-824-5
• DSSTox Substance ID: DTXSID70910001
• Mol file: 62929-02-6.mol

Synonyms:62929-02-6;1-(4-aminophenyl)-1,3,3-trimethyl-2H-inden-5-amine;5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione;SCHEMBL3222635;DTXSID70910001;CDTDIQLZIBORMV-UHFFFAOYSA-N;(C18-H22-N2.C17-H6-O7)x-;106442-40-4;5,5'-Carbonyldi(2-benzofuran-1,3-dione)--1-(4-aminophenyl)-1,3,3-trimethyl-2,3-dihydro-1H-inden-5-amine (1/1)

Chemical Property of CID 6454485

Chemical Property:

• Vapor Pressure: 3.25E-16mmHg at 25°C
• Melting Point: >300°C
• Boiling Point: 638.8°C at 760 mmHg
• Flash Point: 286.2°C
• PSA: 155.85000
• Density: 1.2
• LogP: 6.53950
• Water Solubility.: Insoluble in water.
• Hydrogen Bond Donor Count: 2
• Hydrogen Bond Acceptor Count: 9
• Rotatable Bond Count: 3
• Exact Mass: 588.18965124
• Heavy Atom Count: 44
• Complexity: 954

Purity/Quality:

99% ^*data from raw suppliers

POLYIMIDE RESIN 95.00% ^*data from reagent suppliers

Safty Information:

• Pictogram(s):  
• Hazard Codes: 

MSDS Files:

SDS file from LookChem

Useful:

• Canonical SMILES: CC1(CC(C2=C1C=C(C=C2)N)(C)C3=CC=C(C=C3)N)C.C1=CC2=C(C=C1C(=O)C3=CC4=C(C=C3)C(=O)OC4=O)C(=O)OC2=O
• Uses: Polyimides (PI, also known by alternative brand names: Pyralin Apical, Kapton, and Kaptrex) are polymers made of imide monomers (two carbonyl groups bonded to nitrogen). It has a density of 1430 kg/m3, Young’s modulus 3200 MPa, tensile strength (75–90) MPa, glass transition temperature > 400℃, thermal conductivity of 0.53 W/(m K), and a low relative dielectric constant of 2.9. Polyimides have applications similar to BCBs and also find applications as a low dielectric constant material in high-frequency interconnects (low-k material). The higher thermal conductivity and high glass transition temperature when compared to other types of insulating polymers also makes them a good choice where heat dissipation is important or other applications requiring good thermal management or low parasitic capacitances. Microchannels and high-frequency microdevices embedded in both photosensitive and nonphotosensitive polyimides have been fabricated and reported. Soluble thermoplastic polyimide for high temperature adhesives and compositesPolyimide sealing is utilized to make a permanent and leak-free union between two pieces of silica tubing, stainless steel or glass and press fit unions are most commonly used. Soluble thermoplastic polyimide used for high temperature adhesives and composites. They are used in the electronics industry for flexible cables, as an insulating film on magnet wire and for medical tubing. It is also employed as a mechanical stress buffer. It is utilized for the reverse osmotic film in purification of water or the concentration of dilute materials from water, such as maple syrup production.