109751-35-1

Basic information

• Product Name: 1H-Indene, 2,3-dihydro-1,3,3-trimethyl-5-nitro-1-(4-nitrophenyl)-
• CAS NO: 109751-35-1
• Molecular Formula: C18H18N2O4
• Molecular Weight: 326.352
• Mol File: 109751-35-1.mol
• Article Data: 3

Chemical Properties

• CAS DataBase Reference: 1H-Indene, 2,3-dihydro-1,3,3-trimethyl-5-nitro-1-(4-nitrophenyl)-(CAS DataBase Reference)
• NIST Chemistry Reference: 1H-Indene, 2,3-dihydro-1,3,3-trimethyl-5-nitro-1-(4-nitrophenyl)-(109751-35-1)
• EPA Substance Registry System: 1H-Indene, 2,3-dihydro-1,3,3-trimethyl-5-nitro-1-(4-nitrophenyl)-(109751-35-1)

Safety Data

• Hazardous Substances Data: 109751-35-1(Hazardous Substances Data)

Upstream product

• 3910-35-8 1,1,3-trimethyl-3-phenylindane 

Downstream Products

• 54628-89-6 5-amino-1-(4'-aminophenyl)-1,3,3-trimethylindane 

Relevant articles and documents

Separation and crystal structure of two isomeric of 1,3,3-trimethyl-5- nitro-3-(4-nitrophenyl)-2,3-dihydro-1H-indene and 1,3,3-trimethyl-5-nitro-1-(4- nitrophenyl)-2,3-dihydro-1H-indene

The isomers, 1,3,3-trimethyl-5-nitro-3-(4-nitrophenyl)-2,3-dihydro-1H- indene (1) and 1,3,3-trimethyl-5-nitro-1-(4-nitrophenyl)-2,3-dihydro-1H-indene (2), have been prepared and separated effectively. Their crystal structures can not be confirmed by the r

Polyamide-imide with indan structure and preparation method of polyamide-imide

The invention provides polyamide-imide with an indan structure. The polyamide-imide has a structural formula as shown in the specification, and in the formula, n is from 1 to 8. The invention further discloses a material which is prepared after the polyamide-imide with the indan structure is cured at 220-380 DEG C, and a preparation method of the polyamide-imide with the indan structure. The invention studies the synthesis and the properties of polyamide-imide, thermal-curing polyamide-imide of different polymerization degrees is prepared from 5(6)-amino-1-(4-amino phenyl)-1,3,3-trimethyl indan as monomers, then the stacking density and the interaction of molecular chains can be reduced, the flexibility of the molecular chains can be improved, and finally polyamide-imide resin which is excellent in solubleness and excellent in thermal resistance can be synthesized.