12059-14-2

Basic information

• Product Name: NICKEL SILICIDE
• Synonyms: NICKEL SILICIDE;dinickel silicide;metalsbasisexcludingCo,Co0.1-1%;Nickel silicide, 99% (metals basis excluding Co), Co 0.1-1%;Silanediylidenedinickel(II)
• CAS NO: 12059-14-2
• Molecular Formula: Ni2Si
• Molecular Weight: 145.47
• EINECS: 235-033-1
• Mol File: 12059-14-2.mol
• Article Data: 0

Chemical Properties

• Melting Point: 1255°C
• Boiling Point: °Cat760mmHg
• Flash Point: °C
• Appearance: /Powder
• Density: 7.400
• Water Solubility: Insoluble in water.
• CAS DataBase Reference: NICKEL SILICIDE(CAS DataBase Reference)
• NIST Chemistry Reference: NICKEL SILICIDE(12059-14-2)
• EPA Substance Registry System: NICKEL SILICIDE(12059-14-2)

Safety Data

• TSCA: Yes
• HazardClass: 9
• Hazardous Substances Data: 12059-14-2(Hazardous Substances Data)

Usage

Description

NICKEL SILICIDE is a compound composed of nickel and silicon, known for its unique chemical and physical properties. It is commonly used in various applications due to its ability to enhance the performance of microelectronic devices and other related technologies.

Uses

Used in Microelectronic Devices:
NICKEL SILICIDE is used as contact materials for microelectronic devices, specifically in the semiconductor industry. Its properties make it suitable for creating efficient and reliable connections within these devices.
Used in Electroplating:
NICKEL SILICIDE is used as a key component in the electroplating process. This application takes advantage of its ability to form a durable and protective layer on various surfaces, enhancing their resistance to wear and corrosion.
Used in Field-Effect Transistors:
NICKEL SILICIDE is used as a crucial component in the production of field-effect transistors. The compound is utilized in the creation of nickel silicide/silicon nanowire heterostructures, which are essential for the functioning of these transistors. This application highlights the compound's role in advancing the development of electronic components and devices.

InChI:InChI=1/2Ni.Si/rNi2Si/c1-3-2

Related news

Phase-controlled synthesis of NICKEL SILICIDE (cas 12059-14-2) nanostructures07/29/2019

Dense single-crystalline Ni2Si nanowires, Ni3Si2 nanowires and nanorods, and NiSi nanowires have been successfully synthesized in large-scale on the surface of Ni foam via a simple chemical vapor deposition of SiH4 at 450–600 °C. It is indicated that the reaction temperature and the flow rate ...detailed

Microstructure analysis of the interface situation and adhesion of thermally formed NICKEL SILICIDE (cas 12059-14-2) for plated nickel–copper contacts on silicon solar cells07/27/2019

For low cost high efficiency fully plated NiCu contacts on silicon solar cells, a thermal formation of nickel silicide is commonly performed for adhesion promotion. Since the results of this strategy have been found to be ambiguous, and as the interface situation is not understood, a microstruct...detailed