12775-96-1Relevant articles and documents
E-ALD of Cu nanofilms on Ru/Ta wafers using surface limited redox replacement
Thambidurai, Chandru,Gebregziabiher, Daniel K.,Liang, Xuehai,Zhang, Qinghui,Ivanova, Valentina,Haumesser, Paul-Henri,Stickney, John L.
, p. D466-D471 (2010)
This paper describes the formation of Cu nanofilms on a Ru/Ta-coated wafer using electrochemical atomic layer deposition (E-ALD). The initial steps involved cleaning and oxide removal from the Ru/Ta substrate using ultrahigh vacuum electrochemical system. Auger spectroscopy was used to follow the relative amounts of oxygen, Ru, and Cu on the wafer: as-received, after electrochemical treatment, after ion bombardment, and after Cu deposition. An automated flow cell electrodeposition system was employed to grow Cu nanofilms with up to 200 cycles using surface limited redox replacement (SLRR) reaction. The open-circuit potential was used to follow the exchange of Pb for Cu in the SLRR reaction. Electron probe microanalysis was used to determine the homogeneity of the Cu films. The use of a complexing agent (citrate) greatly improved the homogeneity. Different concentrations of citrate were investigated, containing 2 or 4 mM citrate. Atomic force microscopy images of the Cu films showed the ingress morphology to be the same as the egress when 4 mM citrate was used. A prominent Cu(111) peak was displayed in the X-ray diffraction pattern for 200 cycles of Cu grown on the Ru/Ta-coated wafer.
Hierarchical Copper with Inherent Hydrophobicity Mitigates Electrode Flooding for High-Rate CO2 Electroreduction to Multicarbon Products
Niu, Zhuang-Zhuang,Gao, Fei-Yue,Zhang, Xiao-Long,Yang, Peng-Peng,Liu, Ren,Chi, Li-Ping,Wu, Zhi-Zheng,Qin, Shuai,Yu, Xingxing,Gao, Min-Rui
, p. 8011 - 8021 (2021/05/29)
Copper is currently the material with the most promise as catalyst to drive carbon dioxide (CO2) electroreduction to produce value-added multicarbon (C2+) compounds. However, a copper catalyst on a carbon-based gas diffusion layer electrode often has poor stability - especially when performing at high current densities - owing to electrolyte flooding caused by the hydrophobicity decrease of the gas diffusion layer during operation. Here, we report a bioinspired copper catalyst on a gas diffusion layer that mimics the unique hierarchical structuring of Setaria's hydrophobic leaves. This hierarchical copper structure endows the CO2 reduction electrode with sufficient hydrophobicity to build a robust gas-liquid-solid triple-phase boundary, which can not only trap more CO2 close to the active copper surface but also effectively resist electrolyte flooding even under high-rate operation. We consequently achieved a high C2+ production rate of 255 ± 5.7 mA cm-2 with a 64 ± 1.4% faradaic efficiency, as well as outstanding operational stability at 300 mA cm-2 over 45 h in a flow reactor, largely outperforming its wettable copper counterparts.
Synthesis, Structure, DFT, and Biological Activity of Metal Complexes of Norfloxacin and Metformin Mixed Ligand
Abbass, L. M.,El-Shwiniy, W. H.,El-Telbany, M.,Sadeek, S. A.,Zordok, W. A.
, p. 1774 - 1782 (2021/11/01)
Abstract: A new series of mixed ligand metal complexes has been synthesized by the reaction of Co(II), Ni(II), Cu(II), Zr(IV), Pd(II), and Cd(II) with norfloxacin (NOR) and metformin hydrochloride (MF) in 1 : 1 : 1 molar ratio. The complexes have been characterized by FT-IR, UV-Vis, and 1H NMR spectra, TG/DTG and elemental analysis, molar conductance, and magnetic susceptibility data. According to FT-IR, NOR chelates with metal ions as a bidentate ligand via one oxygen of the carboxylate group and pyridone oxygen, and MF chelates with metal ions via two imine groups. Complexes have been identified as electrolytes. Electronic and magnetic data have indicated the octahedral structure for all complexes except square planar Pd(II) complex. Antibacterial and antifungal activities of the compounds have been tested against several species, and have indicated higher inhibition against micro-organisms for the metal complexes than the mixed ligands.
