2160-94-3

Basic information

• Product Name: 3-CYCLOHEXENE-1,1-DIMETHANOL
• Synonyms: (3-Cyclohexene-1,1-diyl)bismethanol;1-Cyclohexene-4,4-bismethanol;3-Cyclohexene-1,1-bismethanol;3-Cyclohexene-1,1-dimethanol,98%;1,1-bis(hydroxymethyl)-3-cyclohexene;(1-HYDROXYMETHYL-CYCLOHEX-3-ENYL)-METHANOL;3-CYCLOHEXENE-1,1-DIMETHANOL;4,4-BIS(HYDROXYMETHYL)-1-CYCLOHEXENE
• CAS NO: 2160-94-3
• Molecular Formula: C8H14O2
• Molecular Weight: 142.2
• EINECS: 218-481-2
• Mol File: 2160-94-3.mol
• Article Data: 4

Chemical Properties

• Melting Point: 88-90 °C(lit.)
• Boiling Point: 115 °C (0.4 mmHg)
• Flash Point: 105°C
• Appearance: /
• Density: 1.0037 (rough estimate)
• Vapor Pressure: 0.0119mmHg at 25°C
• Refractive Index: 1.4504 (estimate)
• Storage Temp.: 2-8°C
• PKA: 14.66±0.10(Predicted)
• CAS DataBase Reference: 3-CYCLOHEXENE-1,1-DIMETHANOL(CAS DataBase Reference)
• NIST Chemistry Reference: 3-CYCLOHEXENE-1,1-DIMETHANOL(2160-94-3)
• EPA Substance Registry System: 3-CYCLOHEXENE-1,1-DIMETHANOL(2160-94-3)

Safety Data

• Hazard Codes: Xn
• Statements: 22-36/37/38
• Safety Statements: 36
• WGK Germany: 3
• RTECS: GW6050000
• Hazardous Substances Data: 2160-94-3(Hazardous Substances Data)

Usage

Description

3-Cyclohexene-1,1-dimethanol is an organic compound characterized by its beige fine crystalline powder appearance. It is composed of a cyclohexene ring with two hydroxyl groups and two methoxy groups attached to the carbon atoms at the 1st position. This unique structure endows it with specific chemical properties that make it suitable for various applications.

Uses

Used in Epoxy Resin Production:
3-Cyclohexene-1,1-dimethanol is used as a key component in the preparation of epoxy resins for various industrial applications. Its chemical structure allows it to react with other compounds to form highly cross-linked polymers, which exhibit excellent mechanical properties, thermal stability, and resistance to chemicals.
Used in Coatings Industry:
In the coatings industry, 3-Cyclohexene-1,1-dimethanol is used as a curing agent for epoxy resins. The resulting epoxy coatings offer superior adhesion, durability, and resistance to environmental factors, making them ideal for use in automotive, aerospace, and marine applications.
Used in Composites Industry:
3-Cyclohexene-1,1-dimethanol is also utilized in the production of advanced composite materials. The epoxy resins prepared from this compound are combined with various reinforcing fibers to create lightweight, high-strength materials used in the manufacturing of sports equipment, wind turbine blades, and construction materials.
Used in Electrical Insulation:
3-Cyclohexene-1,1-dimethanol-based epoxy resins are employed in the electrical industry for their excellent insulating properties. They are used to produce insulating varnishes, encapsulants, and potting compounds that protect electrical components from moisture, heat, and mechanical stress.
Used in Adhesives and Sealants:
In the adhesives and sealants industry, 3-Cyclohexene-1,1-dimethanol is used to formulate high-performance epoxy adhesives and sealants. These products provide strong bonding, excellent chemical resistance, and good adhesion to various substrates, making them suitable for use in construction, automotive, and aerospace applications.

InChI:InChI=1/C8H14O2/c9-6-8(7-10)4-2-1-3-5-8/h1-2,9-10H,3-7H2

Upstream product

• 50-00-0 formaldehyd 
• 100-50-5 3-Cyclohexene-1-carboxaldehyde 
• 38511-09-0 cyclohex-3-ene-1,1-dicarboxylic acid diethyl ester 

Downstream Products

• 176696-77-8 4,4-ditrityloxymethylcyclohexene 
• 1430117-77-3 methyl 3,3-bis((benzyloxy)methyl)-5-oxo-2-(prop-2-yn-1-yl)cyclopentanecarboxylate 
• 1430117-76-2 methyl 3,3-bis((benzyloxy)methyl)-5-oxocyclopent-1-enecarboxylate 
• 1430117-75-1 methyl 4,4-bis((benzyloxy)methyl)-2-oxocyclopentanecarboxylate 
• 1430117-87-5 dimethyl 3,3-bis((benzyloxy)methyl)hexanedioate 
• 1430117-91-1 C₂₂H₂₆O₆ 
• 79535-58-3 3-cyclohexen-1,1-dimethanol bis (cyclopropane-carboxylic acid ester) 
• 7647-57-6 Spiro<2.5>oct-4-en 
• 21623-88-1 1,1-bis-bromomethyl-cyclohexane 
• 176696-92-7 1-(4,4-Bis-trityloxymethyl-cyclohexyl)-5-methyl-1H-pyrimidine-2,4-dione 
• 176696-79-0 3,3-Bis-trityloxymethyl-7-oxa-bicyclo[4.1.0]heptane 

Relevant articles and documents

Synthesis method and application of epoxy resin low-curing-shrinkage-rate expansion monomer

The invention discloses a synthesis method and application of an epoxy resin low-curing-shrinkage-rate expansion monomer. The synthesis method comprises the following steps: 1, synthesizing 3-cyclohexyl-1, 1-dimethanol, 2, carrying out transesterification on the 3-cyclohexyl-1, 1-dimethanol to synthesize normal orthocarbonate, and 3, carrying out an epoxidation reaction process on the normal orthocarbonate to synthesize the spiro-orthocarbonate expansion monomer containing the epoxy group. When the spiro-orthocarbonate expansion monomer containing the epoxy group is used for a curing reactionof an epoxy resin, the curing shrinkage rate of the epoxy resin can be effectively reduced.

Synthesis of 4,4-disubstituted 2-aminocyclopentanecarboxylic acid derivatives and their incorporation into 12-helical β-peptides

(Chemical equation presented) An enantioselective synthetic route is reported for trans-2-aminocyclopentanecarboxylic acids (ACPC) bearing geminal side chain pairs at the 4-position. β-Peptides containing the 4,4-disubstituted ACPC residues adopt the 12-helical conformation, as demonstrated by 2D NMR analysis in aqueous solution. These 4,4-disubstituted ACPC residues display functional groups, including acidic and hydrogen bond donating groups, in a geometrically defined fashion, which should be useful for the design of β-peptides for specific applications.