2839-52-3Relevant articles and documents
DIAMINE COMPOUND, AND POLYIMIDE PRECURSOR AND POLYIMIDE FILM PREPARED BY USING THE SAME
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Paragraph 0408-0411, (2020/11/03)
The present invention disclosed a novel diamine compound including a structure in which a phenylene linker (L) connecting an intramolecular imide ring and the imide ring is bonded to a phenyl ring substituted with -NH-(C=O)- or -O-(C=O)-. A polyimide film prepared by polymerizing the novel diamine compound has not only improved mechanical and thermal properties, but also an excellent refractive index.COPYRIGHT KIPO 2021