67939-95-1 Usage
General Description
Trimethyl-3-[[(nonafluorobutyl)sulphonyl]amino]propylammonium iodide is a quaternary ammonium compound with the chemical formula C11H20F9IN2O2S. It is a synthetic chemical commonly used as a phase transfer catalyst in various organic reactions. It is a highly water-soluble, non-flammable, and stable compound that is often utilized in the synthesis of pharmaceuticals, agrochemicals, and specialty chemicals. The unique structure of trimethyl-3-[[(nonafluorobutyl)sulphonyl]amino]propylammonium iodide allows it to efficiently transfer ions across immiscible phases, making it a valuable tool in chemical processes for separating and purifying products. However, as with any chemical, proper handling and storage procedures should be followed to ensure safety and minimize potential risks.
Check Digit Verification of cas no
The CAS Registry Mumber 67939-95-1 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 6,7,9,3 and 9 respectively; the second part has 2 digits, 9 and 5 respectively.
Calculate Digit Verification of CAS Registry Number 67939-95:
(7*6)+(6*7)+(5*9)+(4*3)+(3*9)+(2*9)+(1*5)=191
191 % 10 = 1
So 67939-95-1 is a valid CAS Registry Number.
InChI:InChI=1/C10H16F9N2O2S.HI/c1-21(2,3)6-4-5-20-24(22,23)10(18,19)8(13,14)7(11,12)9(15,16)17;/h20H,4-6H2,1-3H3;1H/q+1;/p-1
67939-95-1Relevant articles and documents
FLUORINATED AMINE OXIDE SURFACTANTS
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Paragraph 0135-0136, (2022/02/27)
Compositions including one or more fluorochemical surfactants of the formula: (I) where Rf is a perfluoroalkyl group, each of R1, R2 and R3 are C1-C20 alkyl, alkoxy, or aryl; and R4 is alkylene, arylene of a combination thereof. R4 is preferably an alkylene of 1-20 carbons that may be cyclic or acyclic, may optionally contain catenated or terminal heteroatoms selected from the group consisting of N, O, and S. Most preferably R4 is an alkylene of 2-10 carbon atoms. Described are anionic N-substituted fluorinated amine oxide surfactants, and use thereof in cleaning and in acid etch solutions. The cleaning and etch solutions are used with a wide variety of substrates, for example, in the cleaning and etching of silicon oxide-containing substrates.
