109348-07-4Relevant articles and documents
Selective O-allylation of bisphenol A: Toward a chloride-free route for epoxy resins
Van Rijn, Jimmy A.,Guijt, Marieke C.,Bouwman, Elisabeth,Drent, Eite
, p. 207 - 211 (2011)
The O-allylation of bisphenol A (BPA) has been performed with the most selective catalysts for O-allylation of phenols reported previously. Both the cyclopentadienyl-ruthenium catalysts and the palladium-diphosphine catalysts are capable of selectively performing single and double O-allylation of BPA. An intriguing solvent effect is observed; the choice of the solvent is of key importance for both conversion and selectivity. The use of an excess of diallyl ether as allylating agent results in relatively high yields of the bisallyl ether of bisphenol A, while maintaining the high selectivity for O-allylation.
EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING THE SAME, COMPOSITION AND CURED PRODUCT COMPRISING THE SAME, AND USES THEREOF
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Paragraph 0409; 0410, (2014/07/08)
Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less The cured product of the composition exhibits good flame retardant properties.
2,2-BIS(3-ALLYL-4-HYDROXYPHENYL)PROPANE
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Page/Page column 8-9; 1/1, (2008/06/13)
A high-purity 2,2-diallylbisphenol A which is easy to handle and is solid. It is for use as raw materials for electronic materials, such as a hardener for semiconductor encapsulation materials and an additive for polyimide resins. It is a 2,2-bis(3-allyl-4-hydroxyphenyl)propane which is solid at 30°C and represented by the formula (1). [Chemical formula 1] (1) The solid 2,2-diallylbisphenol A is obtained by subjecting liquid 2,2-diallylbisphenol A obtained through Claisen rearrangement to purification by an alkali treatment to obtain liquid 2,2-diallylbisphenol A having a purity of about 95 wt.% or higher and adding seed crystals to the purified compound to crystallize it.