59501-41-6

Basic information

• Product Name: (3-BROMOPROPOXY)-TERT-BUTYLDIMETHYLSILANE
• Synonyms: 4-(2-(4-(Allyloxy)phenyl)propan-2-yl)phenol;4-[2-(4-prop-2-enoxyphenyl)propan-2-yl]phenol
• CAS NO: 59501-41-6
• Molecular Formula: C₁₈H₂₀O₂
• Molecular Weight: 253.25194
• Mol File: 59501-41-6.mol
• Article Data: 9

Chemical Properties

• Appearance: /
• CAS DataBase Reference: (3-BROMOPROPOXY)-TERT-BUTYLDIMETHYLSILANE(CAS DataBase Reference)
• NIST Chemistry Reference: (3-BROMOPROPOXY)-TERT-BUTYLDIMETHYLSILANE(59501-41-6)
• EPA Substance Registry System: (3-BROMOPROPOXY)-TERT-BUTYLDIMETHYLSILANE(59501-41-6)

Safety Data

• Hazardous Substances Data: 59501-41-6(Hazardous Substances Data)

Usage

General Description

(3-Bromopropoxy)-tert-butyldimethylsilane is a chemical compound that is used in the synthesis of various organic compounds. It is a silane compound, which means it contains a silicon atom bonded to three organic groups and one halogen atom. This particular compound contains a bromine atom and a propoxy group attached to a silicon atom, as well as tert-butyldimethylsilyl groups. It is commonly used as a reagent in organic synthesis reactions, particularly in the protection and deprotection of functional groups. (3-BROMOPROPOXY)-TERT-BUTYLDIMETHYLSILANE is also used as a precursor in the production of pharmaceuticals and other fine chemicals. It is important to handle this compound with care as it is flammable and can react violently with water or air.

Upstream product

• 80-05-7 BPA 
• 591-87-7 Allyl acetate 
• 107-05-1 3-chloroprop-1-ene 
• 107-18-6 allyl alcohol 
• 557-40-4 Allyl ether 
• 106-95-6 allyl bromide 

Downstream Products

• 1426234-64-1 1-(2,2-diethyl-4-methylcyclobutoxy)-4-(2-(4-(prop-1-en-1-yloxy)-phenyl)propan-2-yl)benzene 
• 942061-30-5 C₁₈H₂₀O₂ 
• 1422984-50-6 triethoxy(3-(2-(oxirane-2-ylmethoxy)-5-(2-(4-(oxirane-2-ylmethoxy)phenyl)propane-2-yl)phenyl)propyl)silane 
• 1422984-48-2 2-((2-allyl-4-(2-(4-(oxirane-2-ylmethoxy)phenyl)propane-2-yl)phenoxy)methyl)oxirane 
• 109348-07-4 2-allyl-4-(2-(4-hydroxyphenyl)propane-2-yl)phenol 
• 13634-08-7 C₁₈H₂₂O₄ 
• 5581-32-8 3-[4-[1-[4-(2,3-dihydroxypropoxy)phenyl]-1-methylethyl]phenoxy]propane-1,2-diol 

Relevant articles and documents

THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND

The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.

COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP

There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.

EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION AND CURED MATERIAL COMPRISING SAME, AND USAGE THEREOF

Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, a cured product of the composition and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, a glycidylation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, a cured product of the composition and a use of the composition are provided. The composite of the composition comprising the alkoxysilylated epoxy compound exhibits improved chemical bonding,-good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less via the enhanced chemical bonding efficiency of alkoxysilyl group. The cured product of the composition exhibits good flame retardant properties.