16669-54-8Relevant articles and documents
Synthesis of new macrobicyclic hexaamide ligands
Mo, Zunli,Yang, Wu,Gao, Jinzhang,Chen, Hong,Gong, Qiaojuan,Hou, Jingguo,Kang, Jingwan
, p. 3503 - 3508 (1998)
A new two-step synthesis method of macrobicyclic hexaamide ligands LH6 (I and II) with double condensation of triethyl nitrilotriacetate and 1,4(1,2)-diaminobenzene was developed. The cyclization does not require high dilution and template techniques. Two new hexaamide ligands were prepared in good yields according to the proposed method.
Connector ability to design superhydrophobic and oleophobic surfaces from conducting polymers
Zenerino, Arnaud,Darmanin, Thierry,Taffin De Givenchy, Elisabeth,Amigoni, Sonia,Guittard, Frederic
, p. 13545 - 13549 (2010)
In the aim of creating superoleophobic surfaces using monomers with short perfluorinated chains, to avoid drawbacks associated with PFOA, original semifluorinated (C4F9, C6F13) 3,4-ethylenedioxypyrrole derivatives were synthesized. These monomers were obtained using the faster synthetic method than previously described with some analogues, characterized and electrochemically polymerized on gold plates. The obtained surfaces exhibited superhydrophobic (contact angle with water of 157° and 158°, respectively) and oleophobic properties (contact angle with hexadecane: 88° and 108°, respectively). The comparison between these new monomers and already published analogue EDOP6 confirms the importance of the bipolaronic form of conductive polymer for obtaining surface nanoporosity and as a consequence improving surface oleophobicity. Thus, little change in the molecule design of the connector and the spacer of the monomer can have a significant influence on the surface oleophobicity.
Photocurable resin composition, dry film thereof, pattern forming method, and electrical/electronic part protective film
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, (2012/05/04)
A photocurable composition includes: (A) an epoxy group-containing polymer compound having repeating units represented by the following formula (1), where R1 to R4 are each a hydrocarbon group, m is an integer of 1 to 100, a, b, c and d are each 0 or a positive number, such that 0 (c+d)/(a+b+c+d) ≤ 1.0, and X and Y are each the formula (2) or (3), provided that at least one group of the formula (3) is present, (B) a photoacid generator represented by the formula (8) and (C) a solvent.
POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS
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, (2010/04/23)
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising recurring units containing a non-leaving hydroxyl group represented by formula (1) wherein R1 is H, methyl or trifluoromethyl, X is a single bond or methylene, m is 1 or 2, and the hydroxyl group attaches to a secondary carbon atom. The composition is improved in resolution when processed by lithography.