26306-34-3

Basic information

• Product Name: 4,4’-(dimethylmethylene)bis[2-(2-propenyl)phenyl]diallyl ether
• Synonyms: 4,4’-(dimethylmethylene)bis[2-(2-propenyl)phenyl]diallyl ether
• CAS NO: 26306-34-3
• Molecular Weight: 388.55
• Mol File: 26306-34-3.mol
• Article Data: 8

Chemical Properties

• CAS DataBase Reference: 4,4’-(dimethylmethylene)bis[2-(2-propenyl)phenyl]diallyl ether(CAS DataBase Reference)
• NIST Chemistry Reference: 4,4’-(dimethylmethylene)bis[2-(2-propenyl)phenyl]diallyl ether(26306-34-3)
• EPA Substance Registry System: 4,4’-(dimethylmethylene)bis[2-(2-propenyl)phenyl]diallyl ether(26306-34-3)

Safety Data

• Hazardous Substances Data: 26306-34-3(Hazardous Substances Data)

Upstream product

• 3739-67-1 bisphenol A diallyl ether 
• 591-87-7 Allyl acetate 
• 1745-89-7 2,2-bis(3-allyl-4-hydroxyphenyl)propane 
• 106-95-6 allyl bromide 

Downstream Products

• 71449-73-5 2,2',6,6'-tetraallyl-4,4'-isopropylidenediphenol 
• 71357-47-6 2,2'-(4,4'-(propane-2,2-diyl)bis(2,6-diallyl-4,1-phenylene)bis(oxy)bis(methylene))dioxirane 
• 1422984-60-8 3,3',3,3'-(5,5'-(propane-2,2-diyl)bis(2-(oxirane-2-ylmethoxy)benzene-5,3,1-triyl)tetrakis(propane-3,1-diyl))tetrakis(triethoxysilane) 
• 145672-99-7 5,5’-(propane-2,2-diyl)bis(1,3-diallyl-2-(allyloxy)benzene) 
• 218772-85-1 2,2-bis[3-(3-mercaptopropyl)-4-(3-mercaptopropoxy)phenyl]-propane 
• 1636900-12-3 2,2-bis[3-(3-acetylmercaptopropyl)-4-(3-acetylmercaptopropoxy)-phenyl]propane 

Relevant articles and documents

THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND

The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.

EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING THE SAME, COMPOSITION AND CURED PRODUCT COMPRISING THE SAME, AND USES THEREOF

Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less The cured product of the composition exhibits good flame retardant properties.