71449-73-5

Basic information

• Product Name: 2,2',6,6'-tetraallyl-4,4'-isopropylidenediphenol
• Synonyms: 2,2',6,6'-tetraallyl-4,4'-isopropylidenediphenol
• CAS NO: 71449-73-5
• Molecular Weight: 388.55
• Mol File: 71449-73-5.mol
• Article Data: 7

Chemical Properties

• CAS DataBase Reference: 2,2',6,6'-tetraallyl-4,4'-isopropylidenediphenol(CAS DataBase Reference)
• NIST Chemistry Reference: 2,2',6,6'-tetraallyl-4,4'-isopropylidenediphenol(71449-73-5)
• EPA Substance Registry System: 2,2',6,6'-tetraallyl-4,4'-isopropylidenediphenol(71449-73-5)

Safety Data

• Hazardous Substances Data: 71449-73-5(Hazardous Substances Data)

Upstream product

• 106-95-6 allyl bromide 
• 95-50-1 1,2-dichloro-benzene 
• 3739-67-1 bisphenol A diallyl ether 
• 26306-34-3 4,4’-(dimethylmethylene)bis[2-(2-propenyl)phenyl]diallyl ether 

Downstream Products

• 145672-99-7 5,5’-(propane-2,2-diyl)bis(1,3-diallyl-2-(allyloxy)benzene) 
• 71357-47-6 2,2'-(4,4'-(propane-2,2-diyl)bis(2,6-diallyl-4,1-phenylene)bis(oxy)bis(methylene))dioxirane 
• 1422984-60-8 3,3',3,3'-(5,5'-(propane-2,2-diyl)bis(2-(oxirane-2-ylmethoxy)benzene-5,3,1-triyl)tetrakis(propane-3,1-diyl))tetrakis(triethoxysilane) 

Relevant articles and documents

THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND

The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.

COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP

There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.

Investigations of thiol-modified phenol derivatives for the use in thiol-ene photopolymerizations

Thiol-ene photopolymerizations gain a growing interest in academic research. Coatings and dental restoratives are interesting applications for thiol-ene photopolymerizations due to their unique features. In most studies the relative flexible and hydrophilic ester derivative, namely pentaerythritoltetra(3-mercaptopropionate) (PETMP), is investigated as the thiol component. Thus, in the present study we are encouraged to investigate the performance of more hydrophobic ester-free thiol-modified bis-and trisphenol derivatives in thiol-ene photopolymerizations. For this, six different thiol-modified bis-and trisphenol derivatives exhibiting four to six thiol groups are synthesized via the radical addition of thioacetic acid to suitable allyl-modified precursors and subsequent hydrolysis. Compared to PETMP better flexural strength and modulus of elasticity are achievable in thiol-ene photopolymerizations employing 1,3,5-triallyl-1,3,5-triazine-2,4,6-trione (TATATO) as the ene derivative. Especially, after storage in water, the flexural strength and modulus of elasticity is twice as high compared to the PETMP reference system.